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CMP Polishing Services & Slurries
We provide chemical mechanical polishing (CMP) services and slurries to support wafer planarization and surface finishing in advanced R&D and prototyping. Our offerings include CMP process support for silicon wafers, SOI wafers, compound semiconductors, glass, and optical substrates, along with a range of high-performance polishing slurries.
Key Features
Sub-nanometer surface roughness
High planarization efficiency
Low defectivity
Support for diverse substrate materials
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